A team of researchers from KAIST and Seoul National University has developed a groundbreaking electronic ink that enables room-temperature printing of variable-stiffness circuits capable of switching between rigid and soft modes. This advancement marks a significant leap toward next-generation wearable, implantable, and robotic devices.

< Photo 1. (From left) Professor Jae-Woong Jeong and PhD candidate Simok Lee of the School of Electrical Engineering, (in separate bubbles, from left) Professor Gun-Hee Lee of Pusan ​​National University, Professor Seongjun Park of Seoul National University, Professor Steve Park of the Department of Materials Science and Engineering>

Variable-stiffness electronics are at the forefront of adaptive technology, offering the ability for a single device to transition between rigid and soft modes depending on its use case. Gallium, a metal known for its high rigidity contrast between solid and liquid states, is a promising candidate for such applications. However, its use has been hindered by challenges including high surface tension, low viscosity, and undesirable phase transitions during manufacturing.

On June 4th, a research team led by Professor Jae-Woong Jeong from the School of Electrical Engineering at KAIST, Professor Seongjun Park from the Digital Healthcare Major at Seoul National University, and Professor Steve Park from the Department of Materials Science and Engineering at KAIST introduced a novel liquid metal electronic ink. This ink allows for micro-scale circuit printing – thinner than a human hair – at room temperature, with the ability to reversibly switch between rigid and soft modes depending on temperature.

The new ink combines printable viscosity with excellent electrical conductivity, enabling the creation of complex, high-resolution multilayer circuits comparable to commercial printed circuit boards (PCBs). These circuits can dynamically change stiffness in response to temperature, presenting new opportunities for multifunctional electronics, medical technologies, and robotics.

Conventional electronics typically have fixed form factors – either rigid for durability or soft for wearability. Rigid devices like smartphones and laptops offer robust performance but are uncomfortable when worn, while soft electronics are more comfortable but lack precise handling. As demand grows for devices that can adapt their stiffness to context, variable-stiffness electronics are becoming increasingly important.

< Figure 1. Fabrication process of stable, high-viscosity electronic ink by dispersing micro-sized gallium particles in a polymer matrix (left). High-resolution large-area circuit printing process through pH-controlled chemical sintering (right). >

To address this challenge, the researchers focused on gallium, which melts just below body temperature. Solid gallium is quite stiff, while its liquid form is fluid and soft. Despite its potential, gallium’s use in electronic printing has been limited by its high surface tension and instability when melted.

To overcome these issues, the team developed a pH-controlled liquid metal ink printing process. By dispersing micro-sized gallium particles into a hydrophilic polyurethane matrix using a neutral solvent (dimethyl sulfoxide, or DMSO), they created a stable, high-viscosity ink suitable for precision printing. During post-print heating, the DMSO decomposes to form an acidic environment, which removes the oxide layer on the gallium particles. This triggers the particles to coalesce into electrically conductive networks with tunable mechanical properties.

The resulting printed circuits exhibit fine feature sizes (~50 μm), high conductivity (2.27 × 10⁶ S/m), and a stiffness modulation ratio of up to 1,465 – allowing the material to shift from plastic-like rigidity to rubber-like softness. Furthermore, the ink is compatible with conventional printing techniques such as screen printing and dip coating, supporting large-area and 3D device fabrication.

< Figure 2. Key features of the electronic ink. (i) High-resolution printing and multilayer integration capability. (ii) Batch fabrication capability through large-area screen printing. (iii) Complex three-dimensional structure printing capability through dip coating. (iv) Excellent electrical conductivity and stiffness control capability.>

The team demonstrated this technology by developing a multi-functional device that operates as a rigid portable electronic under normal conditions but transforms into a soft wearable healthcare device when attached to the body. They also created a neural probe that remains stiff during surgical insertion for accurate positioning but softens once inside brain tissue to reduce inflammation – highlighting its potential for biomedical implants.

< Figure 3. Variable stiffness wearable electronics with high-resolution circuits and multilayer structure comparable to commercial printed circuit boards (PCBs). Functions as a rigid portable electronic device at room temperature, then transforms into a wearable healthcare device by softening at body temperature upon skin contact.>

“The core achievement of this research lies in overcoming the longstanding challenges of liquid metal printing through our innovative technology,” said Professor Jeong. “By controlling the ink’s acidity, we were able to electrically and mechanically connect printed gallium particles, enabling the room-temperature fabrication of high-resolution, large-area circuits with tunable stiffness. This opens up new possibilities for future personal electronics, medical devices, and robotics.”

< Figure 4. Body-temperature softening neural probe implemented by coating electronic ink on an optical waveguide structure. (Left) Remains rigid during surgery for precise manipulation and brain insertion, then softens after implantation to minimize mechanical stress on the brain and greatly enhance biocompatibility. (Right) >

This research was published in Science Advances under the title, “Phase-Change Metal Ink with pH-Controlled Chemical Sintering for Versatile and Scalable Fabrication of Variable Stiffness Electronics.” The work was supported by the National Research Foundation of Korea, the Boston-Korea Project, and the BK21 FOUR Program.