RESCHIP4EU - Reinforcing Skills in Chips Design for Europe has taken its mission to grow Europe's semiconductor talent pool directly to students in recent weeks, through an
Innovation Day at Instituto Superior de Engenharia do Porto (ISEP) on June 9th and a dedicated booth at
GEN-E, JA Europe's flagship youth entrepreneurship festival held 7-10 July 2026.
At ISEP, 20 Bachelor’s engineering students took part in RESCHIP4EU Innovation Day organised together with JA Europe and 28DIGITAL. Working in five teams, students were challenged to design a product or service built around a low-power, low-cost embedded device using on-device AI or edge intelligence.
All five teams chose to address healthcare challenges in Portugal, grounding their concepts in real local needs.The winning team, NeuroPatch, pitched a microchip concept designed to be implanted behind the ear to help detect and prevent epilepsy episodes.
RESCHIP4EU also joined
GEN-E, one of the largest youth entrepreneurship festivals of its kind in Europe. Bringing together more than 1,200 participants from over 40 countries, the event offered the project an opportunity to engage directly with Europe’s next generation of entrepreneurs and innovators.
Together with consortium partner JA Europe, RESCHIP4EU welcomed students and visitors to its booth, where the team promoted chip design, presented the
RESCHIP4EU master’s programme in Intelligent Chips and Systems, and encouraged young people to pursue STEM studies and careers in the semiconductor sector.
About RESCHIP4EU
RESCHIP4EU is an EU-funded initiative working to strengthen chip design skills and build a pipeline of talent for Europe's semiconductor sector. At the heart of the project is a double-degree master’s programme in
Intelligent Chips and Systems, combining advanced technical specialisations with a minor in Innovation and Entrepreneurship.
Developed by nine higher education institutions from five countries, together with leading industry and education partners, the programme covers the full journey from silicon and System-on-Chip design to smarter, greener and safer embedded systems.
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